ligitek electronics co.,ltd. property of ligitek only lead-free parts pb LDBK4841 cylindrical type led lamps data sheet doc. no : qw0905-LDBK4841 rev : a date : 04 - apr. - 2006
page 1/5 ligitek electronics co.,ltd. property of ligitek only part no. LDBK4841 package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 0 75% 100%25% 50%025% -60 -30 100% 75% 50% 60 30 1.0 3.8 1.5max 3.8 0.5 typ 3.0 2.54typ 1.0min + - 25.0min
typical electrical & optical characteristics (ta=25 ) symbol esd t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2.the luminous intensity data did not including 15% testing tolerance. operating temperature storage temperature forward current electrostatic discharge( * ) reverse current @5v peak forward current duty 1/10@10khz power dissipation parameter -20 ~ +80 20 forward voltage @20ma(v) spectral halfwidth nm viewing angle 2 1/2 (deg) luminous intensity @ ma(mcd) 90 typ. 30 4.0 3.550 max. typ. min. 110 -30 ~ +100 2/5 page ma 30 ir 150 50 120 100 v a ma mw ratings dbk unit ligitek electronics co.,ltd. property of ligitek only dominant wave length dnm 470 color blue ingan/gan LDBK4841 material part no emittedlens static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LDBK4841 blue transparent
fig.5 relative intensity vs. wavelength typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 1.03.04.0 0 1 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 450 0.0 400500550 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) ambient temperature( ) 0 -20 -40 0.8 0 -40-20 100 80 60 40 20 0.0 60100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 1 10 100 1000 dbk chip page3/5 part no. LDBK4841
260 c3sec max 5 /sec max 260 120 temp( c) time(sec) 150 50 100 2 /sec max 25 0 preheat 0 60 seconds max page4/5 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LDBK4841
page 5/5 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 test item operating life test reliability test: 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition high temperature storage test low temperature storage test thermal shock test solder resistance test high temperature high humidity test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description part no. LDBK4841
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